Method of thermally perforating a heat sensitive stencil

ABSTRACT

A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut so that the quotient obtained by dividing a maximum diameter of a perforation at the time at which supply of energy to the heat source is cut by the energizing time is not smaller than 0.015 m/s and not larger than 0.23 m/s.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to a method of and an apparatus for making astencil by thermally perforating a thermoplastic resin film ofheat-sensitive stencil material by a thermal head or the like, and to aheat-sensitive stencil material. More particularly, this inventionrelates to improvement in shape of perforations, printing quality andstencil making speed.

2. Description of the Related Art

Methods of making a heat-sensitive stencil are broadly divided into amethod in which the resin film side of the heat-sensitive stencilmaterial is brought into close contact with an original bearing thereonan image depicted in a carbon-containing material and the resin film isperforated by heat generated by the image upon exposure to infra-redrays and a method in which the resin film of the heat-sensitive stencilmaterial is imagewise perforated by two-dimensionally scanning the resinfilm side of the heat-sensitive stencil material with a device such as athermal head having an array of micro heater elements. The former methodwill be referred to as “an analog stencil making method” and the lattermethod will be referred to as “a digital stencil making method”, in thisspecification. At the present, the digital stencil making method isprevailing over the analog stencil making method since the former doesnot require carbon in the original and permits easy image processing.

When the stencil is made by the digital stencil making method, it ispreferred that the perforations be discrete by pixel, and be uniform inshape and degree of penetration so that the thin lines and/or edges ofthe printings show rims faithful to the original, the solid portions ofthe printings have a sufficient density and the amount of ink to betransferred to each printing sheet can be well controlled not to causeoffset (the phenomenon the ink on the surface of a first printed sheetstains the back side of a second printed sheet superposed on the surfaceof the first printed sheet).

On the other hand, in order to meet the recent demand for higher imagequality, highly fine or high resolution thermal heads such as of 400 dpior 600 dpi have been in wide use as the thermal device for thermallyperforating the stencil material. Such high resolution thermal devicesare generally lower than low resolution thermal devices in the maximumtemperature they can provide. Accordingly, in order to perforate thestencil material in a given size with the high resolution thermaldevice, the stencil material should be more sensitive to perforationthan when it is perforated by the low resolution thermal device.Further, since the number of perforations (pixels) increases as theresolution increases, it is preferred that the time required to formeach perforation be shortened, that is, each perforation be formed at ahigher speed. Thus, physical properties of the resin film, the structureof the thermal head, and the method of controlling the thermal head formeeting these demands have been searched for.

The thermoplastic resin film for the heat-sensitive stencil materialproduces shrinkage stress and is perforated by shrinkage. In order toimprove sensitivity to perforation of the heat-sensitive stencilmaterial, there has been proposed thermoplastic resin film having aspecified heat shrinkage factor disclosed, for instance, in JapaneseUnexamined Patent Publication No. 4 (1992)-125190 or thermoplastic resinfilm having a specified heat shrinkage factor and a specified heatshrinkage stress disclosed, for instance, in Japanese Unexamined PatentPublication Nos. 7(1995)-52573 and 7(1995)-68964. However, in thesepatent publications, the heat shrinkage factor or the heat shrinkagestress is specified on the basis of measurement of the heat shrinkagefactor or the heat shrinkage stress when the film is heated to severaltens of minutes, which is very long as compared with the time for whichthe film is heated in the actual perforation. Further, the measurementis static and does not reflect the actual perforation. Further, thoughthe heat shrinkage factor or the heat shrinkage stress measured by, forinstance, TMA (thermo-mechanical analysis) under a macroscopic andquasi-static condition where the area to be heated is not smaller thanseveral millimeters (mm) and the temperature change is 10° C./min or sohas been reported, the behavior of the perforations under a microscopicand dynamic condition in the actual stencil making process where thearea to be heated by the thermal head or the like is several tens ofmicrometers (μm) and the temperature change is 1° C./μs or so has notbeen reported. Thus the reported heat shrinkage factor or heat shrinkagestress does not conform to the actual perforation.

Further, conventionally, discussion on the perforation in the stencilmaking process has been made not on the basis of behavior ofperforations in course of perforation but on the final state ofperforations. In such discussion, physical properties of the resin filmand the structure of the thermal head, and the method of controlling thethermal head are generally discussed in order to control the final sizeand shape of the perforations and the TMA data on the film is employedonly to indicate the sensitivity to perforation. Accordingly, theproperties of the film concerning to the degree to which theperforations are discrete by pixel and the shape of the perforations isstabilized are generally incompatible with the sensitivity toperforation of film and the speed at which the film is perforated. Thatis, when a film can be perforated so that the perforations are welldiscrete and uniform in shape, the film is less sensitive to theperforation and takes a long time to perforate. Naturally the oppositionis also true. Accordingly, in the actual design of a stencil makingsystem, a plurality of kinds of thermoplastic resin film are prepared,the sensitivity to perforation of each kind of film is determined byrepeating experiments or TMA measurements, and one of the kinds of filmwhich is most close to a target sensitivity is selected.

The general data on the heat shrinkage factor and heat shrinkage stressdo not always conform to the evaluation of film obtained in the actualdesign of a stencil making system with respect to, for instance,discreteness and uniformity of shape of the perforations, thesensitivity to perforation and the perforating speed. As describedabove, this is because the TMA data and the like are obtained under amacroscopic and quasi-static condition whereas the actual perforation inthe actual stencil making process is effected under a microscopic anddynamic condition. Further, it is difficult to read from the TMA datathe performance of the film representing the perforating speed, thestability of the shape of perforations and the like except thesensitivity to perforation. Even about the sensitivity to perforation,it is difficult to estimate the difference in the sensitivity toperforation between film samples which are slightly different from eachother, for instance, in TMA curve since it is actually impossible toprepare a variety of film samples which are different from each other inone or more particular factor such as the TMA curve with the otherfactors held to be the same. Accordingly, when a suitable kind of resinfilm is to be selected, stencils must be actually made using a varietyof resin film samples, which adds to the development cost.

As described above, information obtained as a characteristic value inthe stencil making experiments is only on the size and shape of theperforations at the time the perforations are completed. Accordingly, ithas been very difficult to know, without experience and sense, how thephysical properties of the resin film should be changed on the basis ofthe result of experiment in order to obtain a desirable form ofperforation, which has been made difficult development of new productsand improvement of the performance of the products. Unsatisfactorydesign of the performance of the resin film can result in the case wherethe sensitivity to perforation and perforating speed are too poor toobtain a high-resolution stencil under a practical condition though theperforations are discrete and substantially uniform in shape or in thecase where the perforations are not discrete and not uniform in shapethough the sensitivity to perforation and perforating speed aresatisfactory.

Thus, it has been impossible to develop, on the basis of conventionaldata experimentally obtained, a method of and an apparatus for making astencil by thermally perforating a thermoplastic resin film ofheat-sensitive stencil material, and a thermoplastic resin film forheat-sensitive stencil material in which demands for uniformity in shapeof perforations, sensitivity to perforation and perforating speed areall satisfied.

SUMMARY OF THE INVENTION

In view of the foregoing observations and description, the primaryobject of the present invention is to provide a method of and anapparatus for making a stencil by thermally perforating a thermoplasticresin film of heat-sensitive stencil material, and a thermoplastic resinfilm for heat-sensitive stencil material in which perforations can bediscrete and uniform in shape, and sensitivity to perforation andperforating speed are high.

In accordance with a first aspect of the present invention, there isprovided a method of making a stencil by thermally forming perforationsarranged in both a main scanning direction and a sub-scanning directionin a thermoplastic resin film of heat-sensitive stencil material by theuse of a heat source which is heated through supply of energy, whereinthe improvement comprises that

supply of energy to the heat source is cut so that the quotient obtainedby dividing a maximum diameter of perforation at the time at whichsupply of energy to the heat source is cut by the energizing time (thetime interval between the time at which supply of energy to the heatsource is started and the time at which supply of energy to the heatsource is cut) is not smaller than 0.015 m/s and not larger than 0.23m/s.

The “maximum diameter” is the diameter which is the largest in diametersin all the directions.

In one embodiment of the method of the first aspect of the presentinvention, supply of energy to the heat source is cut so that thequotient obtained by dividing a maximum diameter of perforation at thetime at which supply of energy to the heat source is cut by theenergizing time is not smaller than 0.06 m/s and not larger than 0.075m/s.

In another embodiment of the method of the first aspect of the presentinvention, supply of energy to the heat source is cut so that thequotient obtained by dividing a maximum diameter of perforation at thetime at which supply of energy to the heat source is cut by theenergizing time is not smaller than 0.015 m/s and not larger than 0.055m/s.

In still another embodiment of the method of the first aspect of thepresent invention, supply of energy to the heat source is cut so thatthe quotient obtained by dividing a maximum diameter of perforation atthe time at which supply of energy to the heat source is cut by theenergizing time is not smaller than 0.08 m/s and not larger than 0.23m/s.

It is preferred that supply of energy to the heat source be cut so thatthe diameters of the perforation in the main scanning direction and thesub-scanning direction “in the final state” (to be apparent later) arenot smaller than 45% and not larger than 80% of the scanning pitches inthe respective directions.

In terms of area, it is preferred that supply of energy to the heatsource be cut so that the area of the perforation “in the final state”is not smaller than 20% and not larger than 50% of the product of thescanning pitches in the main scanning direction and in the sub-scanningdirection.

In accordance with a second aspect of the present invention, there isprovided an apparatus for making a stencil comprising a heat sourcewhich is heated through supply of energy, a heat source control meanswhich supplies energy to the heat source and a scanning means whichscans a thermoplastic resin film of heat-sensitive stencil material withthe heat source to thermally form perforations arranged in both a mainscanning direction and a sub-scanning direction in the thermoplasticresin film, wherein the improvement comprises that

the heat source control means cuts supply of energy to the heat sourceso that the quotient obtained by dividing a maximum diameter ofperforation at the time at which supply of energy to the heat source iscut by the energizing time is not smaller than 0.015 m/s and not largerthan 0.23 m/s.

In one embodiment of the apparatus of the second aspect of the presentinvention, the heat source control means cuts supply of energy to theheat source so that the quotient obtained by dividing a maximum diameterof perforation at the time at which supply of energy to the heat sourceis cut by the energizing time is not smaller than 0.06 m/s and notlarger than 0.075 m/s.

In another embodiment of the apparatus of the second aspect of thepresent invention, the heat source control means cuts supply of energyto the heat source so that the quotient obtained by dividing a maximumdiameter of perforation at the time at which supply of energy to theheat source is cut by the energizing time is not smaller than 0.015 m/sand not larger than 0.055 m/s.

In still another embodiment of the apparatus of the second aspect of thepresent invention, the heat source control means cuts supply of energyto the heat source so that the quotient obtained by dividing a maximumdiameter of perforation at the time at which supply of energy to theheat source is cut by the energizing time is not smaller than 0.08 m/sand not larger than 0.23 m/s.

It is preferred that the heat source control means cuts supply of energyto the heat source so that the diameters of the perforation in the mainscanning direction and the sub-scanning direction “in the final state”are not smaller than 45% and not larger than 80% of the scanning pitchesin the respective directions.

In terms of area, it is preferred that the heat source control meanscuts supply of energy to the heat source so that the area of theperforation “in the final state” is not smaller than 20% and not largerthan 50% of the product of the scanning pitches in the main scanningdirection and in the sub-scanning direction.

In accordance with a third aspect of the present invention, there isprovided a thermoplastic resin film for stencil material which isscanned by a heat source, which is heated through supply of energy, inboth a main scanning direction and a sub-scanning direction and isthermally formed with perforations arranged in the main scanning andsub-scanning directions in the thermoplastic resin film, wherein theimprovement comprises that

the heat shrinkable properties of the thermoplastic resin film are suchthat the mean enlarging speed over the energizing time of the diameterof perforation in the direction in which the diameter of the perforationis the largest in all the directions at the time at which supply ofenergy to the heat source is cut is not smaller than 0.015 m/s and notlarger than 0.23 m/s.

In one embodiment of the thermoplastic resin film for stencil materialof the third aspect of the present invention, the heat shrinkableproperties of the thermoplastic resin film are such that the meanenlarging speed over the energizing time of the diameter of perforationin the direction in which the diameter of the perforation is the largestin all the directions at the time at which supply of energy to the heatsource is cut is not smaller than 0.06 m/s and not larger than 0.075m/s.

In another embodiment of the thermoplastic resin film for stencilmaterial of the third aspect of the present invention, the heatshrinkable properties of the thermoplastic resin film are such that themean enlarging speed over the energizing time of the diameter ofperforation in the direction in which the diameter of the perforation isthe largest in all the directions at the time at which supply of energyto the heat source is cut is not smaller than 0.015 m/s and not largerthan 0.055 m/s.

In still another embodiment of the thermoplastic resin film for stencilmaterial of the third aspect of the present invention, the heatshrinkable properties of the thermoplastic resin film are such that themean enlarging speed over the energizing time of the diameter ofperforation in the direction in which the diameter of the perforation isthe largest in all the directions at the time at which supply of energyto the heat source is cut is not smaller than 0.08 m/s and not largerthan 0.23 m/s.

With reference to FIG. 5, “the diameter of the perforation” is definedas follows. That is, in a perforation 21, the diameter of theperforation 21 in a given direction is a length 25 of an orthographicprojection of the inner periphery (a boundary defined by a dark regionof the inner slope of the rim to be described later in a bright-fieldimage obtained though an optical microscope) of the rim 23 (an annularthickened part generated by thermal perforation) of the perforation 21onto a straight line 24 parallel to the given direction.

The “area of the perforation” is the area of the part 22 (FIG. 5)circumscribed by the inner periphery of the rim.

These inventors have found a method of evaluating perforation from anovel point of view. That is, we observed the phenomenon that a smallperforation was formed and enlarged with time when the thermoplasticresin film of the stencil material was brought into contact with theheat source such as a thermal head by the use of a system which couldtake an image in a microscopic field of view of the order of μm at ahigh speed of μs. The result is shown in FIG. 6. In FIG. 6, the ordinaterepresents the diameter of the perforation and the abscissa representsthe time from the time supply of energy to the heat source (i.e., theenergizing time) is initiated. From FIG. 6, we have found thatperforation occurs in the following four stages.

In the first stage, the thermoplastic resin film is heated by a heaterelement (heat source) of a thermal head the temperature of which is thehighest at the center thereof and is lowered toward its periphery. Thetemperature of the film is the highest at a part in contact with thecenter of the heater element and as the distance from the part incontact with the center of the heater element increases, the temperatureof the film lowers. When the temperature of the film exceeds a shrinkageinitiation temperature at which the film starts to shrink, shrinkagestress, which tends to reduce the distance between any two points on thefilm, is generated and accordingly, tension is produced in any point ofareas which are not lower than the shrinkage initiation temperature. Thedirection of the tension is substantially perpendicular to (justperpendicular to if thermal shrinkage is isotropic) isothermal lines onthe film. On the other hand, where the temperature of the film issufficiently low, no shrinkage stress is generated. Accordingly, resinof the film is moved away from the highest temperature point of the filmas if it slides down the temperature gradient.

In the second stage, an initial small perforation is generated near thehighest temperature point of the film.

In the third stage, the outer periphery of the initial small perforationis pulled outward by tension from outside, whereby the perforation isenlarged (growth of the perforation by shrinkage stress). The outerperiphery of the perforation is pulled outward and increases its volumetaking in resin on its path, whereby the rim is formed.

In the fourth stage, the heater element is de-energized and itstemperature lowers. As the temperature of the heater element lowers, thetemperature of the film in contact with the heater element lowers, andwhen the temperature of the film becomes lower than the shrinkageinitiation temperature, no tension acts on the rim and the shape of theperforation is fixed (end of the perforation). The diameter or the areaof the perforation as measured in this stage will be referred to as thediameter or the area of the perforation “in the final state”,hereinbelow.

Thus we have found that the aforesaid incompatible requirements, thatis, discreteness of the perforations, stability in shape of theperforations, sensitivity to perforation of the stencil material andhigh speed perforation, can be balanced at a high level by setting in acertain range the quotient obtained by dividing by the energizing time amaximum diameter of the perforation at the time at which supply ofenergy to the heat source is cut out of the various parameters obtainedfrom the perforation size versus energizing time curve.

That is, the aforesaid incompatible requirements can be balanced at ahigh level by cutting supply of energy to the heat source when thequotient obtained by dividing by the energizing time a maximum diameterof the perforation at the time at which supply of energy to the heatsource is cut is in the range of 0.015 m/s to 0.23 m/s. When supply ofenergy to the heat source is cut before the quotient obtained bydividing by the energizing time a maximum diameter of the perforation atthe time at which supply of energy to the heat source is cut reaches0.015 m/s, sensitivity to perforation deteriorates and the perforationscannot be formed at a satisfactory speed. Whereas, when supply of energyto the heat source is cut after the quotient obtained by dividing by theenergizing time a maximum diameter of the perforation at the time atwhich supply of energy to the heat source is cut exceeds 0.23 m/s, theperforations cannot be discrete and at the same time the shape of theperforations becomes unstable. Further, in this case, since the heatsource is heated to a high temperature, the heat source is apt to bedamaged.

When supply of energy to the heat source is cut when the quotientobtained by dividing by the energizing time a maximum diameter of theperforation at the time at which supply of energy to the heat source iscut is in the range of 0.06 m/s to 0.075 m/s, discreteness ofperforations is better ensured, the shape of the perforations can bemore stabilized, and sensitivity to perforation and perforating speedare increased. When supply of energy to the heat source is cut beforethe quotient reaches 0.06 m/s, sensitivity to perforation andperforating speed are unsatisfactory, whereas when supply of energy tothe heat source is cut after the quotient exceeds 0.075 m/s, highperformance cannot be realized in discreteness of the perforations andstability in shape of the perforations. Thus, in this embodiment, highgeneric performance can be obtained in a general use printer whererequirement on discreteness of the perforations and stability of theshape of the perforations and requirement of sensitivity to perforationand perforating speed are to be balanced at a high level.

When supply of energy to the heat source is cut when the quotientobtained by dividing by the energizing time a maximum diameter of theperforation at the time at which supply of energy to the heat source iscut is in the range of 0.015 m/s to 0.055 m/s, the image can be high inreproducibility and high in quality. More specifically when the quotientis in the range, the perforating speed is low, and accordingly, thethermoplastic resin film can well follow change in temperature of theheat source. That is, the shape of the perforation in the filmfaithfully reflects the temperature contrast on the heat source, wherebythe perforations can be uniform in shape and size and the amount of inkto be transferred through the stencil can be constant, which results ina high quality image. Thus the method and the apparatus are very usefulwhen an especially high image is required.

When supply of energy to the heat source is cut when the quotientobtained by dividing by the energizing time a maximum diameter of theperforation at the time at which supply of energy to the heat source iscut is in the range of 0.08 m/s to 0.23 m/s, sensitivity to perforationand perforating speed can be high. More specifically when the quotientis in the range, the perforating speed is high, and accordingly, thetotal energy supplied to the heat source to obtain a perforation of agiven size can be reduced by shortening the energizing time and/orreducing energy supplied to the heat source per unit time. When thetotal energy supplied to the heat source is reduced, heat accumulated inthe heat source and/or heat transfer parts can be reduced, whereby thenumber of printings obtained per unit time can be enlarged.

Further, when supply of energy to the heat source is cut so that thediameters of the perforation in the main scanning direction and thesub-scanning direction “in the final state” are not smaller than 45% andnot larger than 80% of the scanning pitches in the respectivedirections, the amount of ink transferred through the stencil obtainedcan be such that offset can be avoided in solid parts while necessarydensity is ensured, and thin character parts can be sufficient in widthand density.

In terms of the area of the perforation, when supply of energy to theheat source is cut so that the area of the perforation “in the finalstate” is not smaller than 20% and not larger than 50% of the product ofthe scanning pitches in the main scanning direction and in thesub-scanning direction, the amount of ink transferred through thestencil obtained can be such that offset can be avoided in solid partswhile necessary density is ensured, and thin character parts can besufficient in width and density.

When the heat shrinkable properties of the thermoplastic resin film forthe stencil material are such that the mean enlarging speed over theenergizing time of the diameter of perforation in the direction in whichthe diameter of the perforation is the largest in all the directions atthe time at which supply of energy to the heat source is cut is notsmaller than 0.015 m/s and not larger than 0.23 m/s, the perforationscan be discrete, the shape of the perforations can be stabilized, andsensitivity to perforation and perforating speed can be satisfactory.When the mean enlarging speed is smaller than 0.015 m/s, sensitivity toperforation deteriorates and the perforations can not be formed at asatisfactory speed. Whereas, when the mean enlarging speed is largerthan 0.23 m/s, the perforations cannot be discrete and at the same timethe shape of the perforations becomes unstable. Further, in this case,since the heat source is heated to a high temperature, the heat sourceis apt to be damaged.

When the heat shrinkable properties of the thermoplastic resin film forthe stencil material are such that the mean enlarging speed over theenergizing time of the diameter of perforation in the direction in whichthe diameter of the perforation is the largest in all the directions atthe time at which supply of energy to the heat source is cut is notsmaller than 0.06 m/s and not larger than 0.075 m/s, discreteness ofperforations is better ensured, the shape of the perforations can bemore stabilized, and sensitivity to perforation and perforating speedare increased. When the mean enlarging speed is smaller than 0.06 m/s,sensitivity to perforation and perforating speed are unsatisfactory,whereas when the mean enlarging speed is larger than 0.075 m/s, highperformance cannot be realized in discreteness of perforations andstability in shape of the perforations. Thus, in this embodiment, highgeneric performance can be obtained in a general use printer whererequirement on discreteness of perforations and stability of the shapeof the perforations and requirement on sensitivity to perforation andperforating speed are to be balanced at a high level.

When the heat shrinkable properties of the thermoplastic resin film forthe stencil material are such that the mean enlarging speed over theenergizing time of the diameter of perforation in the direction in whichthe diameter of the perforation is the largest in all the directions atthe time at which supply of energy to the heat source is cut is notsmaller than 0.015 m/s and not larger than 0.055 m/s, the image can behigh in reproducibility and high in quality. More specifically when themean enlarging speed is in the range, the perforating speed is low, andaccordingly, the thermoplastic resin film can well follow change intemperature of the heat source. That is, the shape of the perforation inthe film faithfully reflect the temperature contrast on the heat source,whereby the perforations can be uniform in shape and size and the amountof ink to be transferred through the stencil can be constant, whichresults in a high quality image. Thus the film of this embodiment isvery useful when an especially high image is required.

When the heat shrinkable properties of the thermoplastic resin film forthe stencil material are such that the mean enlarging speed over theenergizing time of the diameter of the perforation in the direction inwhich the diameter of the perforation is the largest in all thedirections at the time at which supply of energy to the heat source iscut is not smaller than 0.08 m/s and not larger than 0.23 m/s,sensitivity to perforation and perforating speed can be high. Morespecifically when the mean enlarging speed is in the range, theperforating speed is high, and accordingly, the total energy supplied tothe heat source to obtain a perforation of a given size can be reducedby shortening the energizing time and/or reducing energy supplied to theheat source per unit time. When the total energy supplied to the heatsource is reduced, heat accumulated in the heat source and/or heattransfer parts can be reduced, whereby the number of printings obtainedper unit time can be enlarged.

The values of the diameter and the area of the perforations are not asmeasured in the thermoplastic film laminated on the porous support sheet(to form a heat-sensitive stencil) but as measured in the thermoplasticfilm by itself. This is because it is very difficult to observe thestate of perforation and to measure the diameter and/or the area of theperforation in a state where the thermoplastic film is laminated on theporous support sheet. However, the state of perforation (the diameterand/or the area of the perforation) as measured in the thermoplasticfilm by itself has a high correlation with that as measured in thethermoplastic film laminated on the porous support sheet. FIGS. 7 and 8show the correlation. In FIG. 7, the ordinate represents the diametersof the perforations in the final state when a heat-sensitive stencilmaterial (a thermoplastic film and a porous support sheet laminatedtogether) is perforated under various conditions and the abscissarepresents the diameters of the perforations in the final state when thesame thermoplastic film as that employed in the heat-sensitive stencilmaterial is perforated by itself under the same conditions. Thecorrelation coefficient of the graph shown in FIG. 7 is 0.913. In FIG.8, the ordinate represents the areas of the perforations in the finalstate when a heat-sensitive stencil material (a thermoplastic film and aporous support sheet laminated together) is perforated under variousconditions and the abscissa represents the areas of the perforations inthe final state when the same thermoplastic film as that employed in theheat-sensitive stencil material is perforated by itself under the sameconditions. The correlation coefficient of the graph shown in FIG. 8 is0.9319. Thus it will be understood that the state of perforation in thethermoplastic film by itself can represent the state of perforation inthe heat-sensitive stencil material comprising the thermoplastic filmlaminated with a porous support sheet.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view showing a heat-sensitive stencil makingapparatus in accordance with an embodiment of the present invention,

FIG. 2 is a view showing the relation between the temperature of theheater element and the square pulse applied to the heater element,

FIG. 3 is a view showing the relation between the temperature of theheater element and the intermittent pulse applied to the heater element,

FIG. 4A is a fragmentary plan view showing an important part of thethermal head,

FIG. 4B is a cross-sectional view taken along line Y—Y in FIG. 4A,

FIG. 4C is a cross-sectional view taken along line X—X in FIG. 4A,

FIG. 5 is a schematic view showing a perforation,

FIG. 6 is a graph showing change in diameter of the perforation duringformation thereof,

FIG. 7 is a graph showing the correlation between the diameter of theperforation as measured in the thermoplastic film by itself with that asmeasured in the thermoplastic film laminated on the porous supportsheet, and

FIG. 8 is a graph showing the correlation between the area of theperforation as measured in the thermoplastic film by itself with that asmeasured in the thermoplastic film laminated on the porous supportsheet.

DESCRIPTION OF THE PREFERRED EMBODIMENT

In FIG. 1, a stencil making apparatus 8 in accordance with an embodimentof the present invention comprises a thermal head 4 having an array of aplurality of heater elements 5 (only one is visible in FIG. 1), and aplaten roller 3. A heat-sensitive stencil material 1 is conveyed in thedirection of arrow A when the platen roller 3 is driven by an electricmotor (not shown) and passed between the platen roller 3 and the thermalhead 4 with the side of a thermoplastic film 1 a of the stencil material1 facing the thermal head 4. Thus the heater elements 5 of the thermalhead 4 are pressed against the thermoplastic film 1 a of the stencilmaterial 1 and the thermoplastic film 1 a is perforated by the heaterelements 5 energized by a head drive circuit 6. The energy supplied tothe heater elements by the head drive circuit 6 is controlled by acontroller 7. In order to increase the perforating speed, the heaterelements 5 are divided into a plurality of blocks, and the head drivecircuit 6 drives the heater elements 5 block by block.

In this stencil making apparatus 8, power (voltage) in the form of acontinuous square wave is supplied to the heater element 5 to perforatea perforation corresponding to one pixel as shown in FIG. 2. Integrationof supplied power with time is supplied energy. While power is beingsupplied, the temperature of the surface of the heater element 5increases and when power supply is cut, the temperature of the surfaceof the heater element 5 comes to lower. FIG. 2 is an example of changein the temperature of the surface of the heater element 5 at its centeras measured by an infrared radiation thermometer. When the heaterelement 5 is heated in the pattern shown in FIG. 2, the part of thethermoplastic resin film of the stencil material is perforated throughheat shrinkage. The heater element 5 may be supplied with power ofintermittent waveform as shown in FIG. 3. In the case where the heaterelement 5 is supplied with power of intermittent waveform, the time thelast pulse is terminated is considered to be the time supply of energyto the heater element 5 is cut. The waveform of power supplied to theheater element 5 need not be limited to a square wave having constantpower, but may be, for instance, an analog waveform.

As shown in FIGS. 4A to 4C, the thermal head 4 is of a standardstructure of a full glaze thin film type thermal head in this particularembodiment, though need not be limited to such a structure. For example,a partial glaze thin film type thermal head or a thick film type thermalhead may be employed. In FIGS. 4A to 4C, the thermal head 4 comprises aninsulating substrate 11 (e.g., of ceramic) and a glaze layer 12 formedon a metal heat radiator (not shown) in this order. Further, a pluralityof resistor strips 13, each extending in a sub-scanning direction shownby arrow Y, are formed on the glaze layer 12 arranged in a main scanningdirection shown by arrow X electrically spaced from each other byseparating belts 16. Further, a common electrode 15 a and a discreteelectrode 15 b are formed over each resistor strip 13 opposed to eachother and spaced from each other in the sub-scanning direction. When anelectric voltage is applied between the common electrode 15 a and thediscrete electrode 15 b, an electric current flows through the resistorstrip 13 between the common electrode 15 a and the discrete electrode 15b and the resistor strip 13 generates Joule heat. That is, the part ofthe resistor strip 13 between the common electrode 15 a and the discreteelectrode 15 b forms a heater element 5. The surface of the thermal head4 is covered with a protecting layer 17 and the heater element 5(resistor strip 13) is brought into contact with the thermoplastic film1 a of the stencil material 1 with the protecting layer 17 interveningtherebetween. The stencil material 1 is two-dimensionally scanned by theheater element 5 by moving the thermal head 4, having a heater elementarray extending in the main scanning direction, with respect to thestencil material 1 in the sub-scanning direction.

It is preferred that the heat shrinkable properties of the thermoplasticresin film 1 a of the stencil material 1 be such that the mean enlargingspeed over the energizing time of the diameter of perforation in thedirection in which the diameter of the perforation is the largest in allthe directions at the time at which supply of energy to the heat sourceis cut is not smaller than 0.015 m/s and not larger than 0.23 m/s, andmore preferably not lower than 0.06 m/s and not larger than 0.075 m/s.Depending on the purpose, the mean enlarging speed over the energizingtime of the diameter of perforation in the direction in which thediameter of the perforation is the largest in all the directions at thetime at which supply of energy to the heat source is cut is not smallerthan 0.015 m/s and not larger than 0.055 m/s, and more preferably notlower than 0.015 m/s and not larger than 0.045 m/s. Depending on thepurpose, the mean enlarging speed over the energizing time of thediameter of perforation in the direction in which the diameter of theperforation is the largest in all the directions at the time at whichsupply of energy to the heat source is cut is not smaller than 0.08 m/sand not larger than 0.23 m/s, and more preferably not lower than 0.09m/s and not larger than 0.23 m/s.

It is preferred that supply of energy to the heater element 5 be cut sothat the quotient obtained by dividing a maximum diameter of perforationat the time at which supply of energy to the heat source is cut by theenergizing time (the time interval between the time at which supply ofenergy to the heat source is started and the time at which supply ofenergy to the heat source is cut) is not smaller than 0.015 m/s and notlarger than 0.23 m/s, and more preferably not smaller than 0.06 m/s andnot larger than 0.075 m/s. Depending on the purpose, the quotient ispreferably not smaller than 0.015 m/s and not larger than 0.055 m/s, andmore preferably not lower than 0.015 m/s and not larger than 0.045 m/s.Depending on the purpose, the quotient is not smaller than 0.08 m/s andnot larger than 0.23 m/s, and more preferably not lower than 0.09 m/sand not larger than 0.23 m/s. The controller 7 controls the head drivecircuit 6 so that power supply to the heater element 5 is cut in themanner described above.

As the thermoplastic resin film 1 a of the heat-sensitive stencilmaterial 1, polyester series resins such as polyethylene terephthalate,polyolefin series resins such as polyethylene, polypropylene,polystyrene, and the like, halogenated polymers such as polyvinylidenechloride, polyvinylidene fluoride, and the like, vinyl polymer such aspolyvinyl alcohol, and polyamide series resins may be employed. Amongthose, polyester series resin is especially preferred.

“Polyester series resins” include all the polymers obtained bypolycondensation of aromatic dicarboxylic acids, aliphatic dicarboxylicacids, or alicyclic dicarboxylic acids and diols or hydroxycarboxylicacids.

As the acid component, terephthalic acid, isophthalic acid,2,6-naphthalenedicarboxylic acid, adipic acid, sebacic acid, succinicacid, 1, 4-cyclohexanedicarboxylic acid, and the like may be used. Oneor more of these acids may be used. Further, a part of the oxy-acid ofhydroxybenzoic acid may be copolymerized.

As the diol component, ethylene glycol, 1,4-butanediol, 1,6-hexanediol,1,4-cyclohexanedimethanol and the like are preferred. One or more ofthese diols may be used. Further, various combinations of lactic acidsand hydroxycarboxylic acids can be employed.

As the polyester for the polyester film, polyethylene terephthalate,copolymer of ethylene terephthalate and ethylene isophthalate,polybutylene terephthalate, a blend of polyethylene terephthalate andpolybutylene terephthalate, polyethylene-2,6-naphthalate,polyhexamethylene terephthalate, copolymer of hexamethyleneterephthalate and 1,4-cyclohexanedimethylene, L-lacticacids,D-lacticacids and the like are preferably employed.

It is preferred that the thermoplastic resin film 1 a is biaxiallyoriented. The biaxially oriented thermoplastic resin film may beoriented in any method including inflation biaxial co-orientationmethod, tenter biaxial co-orientation method and tenter biaxial sequenceorientation method.

For example, the biaxially oriented thermoplastic resin film may beobtained by preparing un-oriented film by extruding a polymer on a castdrum by T-die extrusion, orienting the un-oriented film in thelongitudinal direction by a series of heated rolls, and orienting thelongitudinally oriented film in the transverse direction on a tenter orthe like as desired. In the case of biaxial sequence orientation, thefilm is generally oriented in the longitudinal direction first and thenoriented in the transverse direction. However, the film may be orientedin the transverse direction first and then oriented in the longitudinaldirection. The thickness of the un-oriented film can be controlled byadjusting the slid width of the cap, the amount of the dischargedpolymer and the rotating speed of the cast drum. The un-oriented filmcan be oriented at a desired draw ratio by adjusting the rotating speedof the heated rolls and/or the set width of the tenter. Though need notbe limited in any direction, the draw ratio is preferably 1.5× to 8×,and more preferably 3× to 8× in both the longitudinal and transversedirections. It is preferred that the orientation temperature be betweenthe glass transition temperature (Tg) of the polyester film and the coldcrystallization temperature (Tc).

Though depending upon the sensitivity requirement on the stencilmaterial, the thickness of the thermoplastic resin film is normally 0.1to 10 μm, preferably 0.1 to 5 μm, and more preferably 0.1 to 3 μm. Whenthe thermoplastic resin film is larger than 10 μm in thickness, the filmcan become difficult to perforate and when the thermoplastic resin filmis smaller than 0.1 μm in thickness, formation of the film sometimescannot be stabilized.

It is preferred that the thermoplastic resin film 1 a has one or moremelting points in the range of 150 to 240° C., and more preferably inthe range of 160 to 230° C. When the melting point is higher than 240°C., high sensitivity to perforation cannot be obtained, whereas when themelting point is lower than 150° C., the thermal dimensional stabilityof the film deteriorates and the film curls during manufacture of thestencil or during storage of the stencil, whereby printing image qualitybecomes unsatisfactory.

The thermoplastic resin film is provided with adequate slip propertiesby roughening the surface in order to improve workability in the filmtake-up step during manufacture of the film, the coating step during thestencil making, the laminating step and the printing step. Inorganicparticles such as of clay, mica, titanium oxide, calcium carbonate,kaolin, talc, wet or dry silica, alumina, zirconia and the like andorganic particles such as those including, as an ingredient, acrylicacids, styrene and the like may be employed to roughen the surface ofthe resin film. The amount of the particles is preferably 0.05 to 10parts by weight and more preferably 0.1 to 3 parts by weight per 100parts by weight of resin. The mean particle size is preferably 0.01 to 3μm and more preferably 0.1 to 2 μm. A plurality of kinds of particlesdifferent in kind and mean particle size may be employed.

If necessary, the thermoplastic resin film may be added with flameretarder, thermal stabilizer, antioxidant, ultraviolet absorber,antistatic agent, pigment, dye, organic lubricant such as fatty esterand wax, anti-foam agent such as polysiloxane, and the like.

As the porous support sheet, any known porous support sheet may beemployed so long as it is permeable to printing ink. For example, silkpaper or paper made of synthetic fiber (as a major component) blendedwith natural fiber, paper made of synthetic fiber, unwoven fabric,fabric, screen gauze and the like may be employed. As the natural fiber,Manila hemp, kozo, mitsumata, pulp and the like are generally employed,and as the synthetic fiber, polyester, vinylon, nylon, rayon and thelike are generally employed.

The thermoplastic resin film and the porous support sheet may belaminated in any away so long as they cannot be normally separated fromeach other and the state of lamination do not interfere with formationof perforations or passage of ink through the stencil. Generally thethermoplastic resin film and the porous support sheet are bondedtogether by adhesive. However, when the support sheet is of syntheticresin, the film and the support sheet may be thermowelded. As theadhesive, vinyl acetate series adhesives, acrylic series adhesives,vinyl chloride/vinyl acetate copolymer series adhesives, polyesterseries adhesives, urethane series adhesives and the like may begenerally employed. Ultraviolet curing adhesives such as compositions ofa photopolymerization initiator with a polyester series acrylate,urethane series acrylate, epoxy series acrylate or polyol seriesacrylate may also be employed. Among those, adhesive containing thereinan urethane series acrylate as a major component is especiallypreferred. From the viewpoint of sharpness of printings, it is preferredthat the thermoplastic resin film and the porous support sheet be bondedtogether by thermowelding without using adhesive. As the thermowelding,thermocompression bonding where the film and the support sheet arepressed against each other under an elevated temperature is generallyemployed. The thermocompression bonding may be carried out in anymanner. However, it is preferred to use heated rolls in view of easinessin processing. The stencil material may be made by thermowelding aporous support sheet of unwoven fabric of thermoplastic polymer to athermoplastic resin film during manufacture thereof and orienting thethermoplastic resin film and the support sheet. This process isadvantageous in that the resin film is reinforced by the support sheetand is prevented from being broken, whereby the resin film formation isstabilized.

It is preferred that the surface of the thermoplastic resin film beprovided with a releasing layer in order to prevent sticking uponperforation. The releasing layer may be formed by coating a releasingagent in any manner. However, it is preferred that the releasing agentbe coated by a roll coater, a gravure coater, a reverse roll coater, abar coater or the like.

As the releasing agent, known releasing agents such as those includingsilicone oil, silicone series resin, fluorine series resin,surface-active agent can be employed. The releasing agent may be addedwith various additives including antistatic agent, heat-resistant agent,antioxidant, organic particles, inorganic particles, pigment and thelike. Further, in order to improve dispersion in water, the releasingagent coating solution may be added with various additives such asdispersing agent, surface-active agent, preservative, anti-foam agent.From the viewpoint of running of the thermal head and/or stain of thethermal head, the thickness of the releasing layer is preferably in therange of 0.01 μm to 0.4 μm and more preferably 0.05 μm to 0.4 μm.

In order to prove the effect of the present invention, an experiment(embodiments 1 to 12 of the present invention and comparative examples 1and 2) was conducted as follows.

In the experiment, each thermoplastic resin film by itself wasperforated and the shape of the perforation was evaluated. Further thesame film was bonded to a support sheet to form a heat-sensitive stencilmaterial and a stencil was made by perforating the stencil material.Then the shape of perforations in the stencil was evaluated andprintings obtained through the stencil were evaluated. Eachthermoplastic resin film by itself was perforated under the conditionshown in the following table 1 by pressing the heater element side ofthe thermal head against the film in an stencil making apparatus whichwas the same as that shown in FIG. 1 except that it was not providedwith the platen roller 3. The experiment was conducted at the roomtemperature.

Specifically, the thermoplastic resin film by itself was perforated inthe following manner and the shape of the perforation was evaluated inthe following manner.

A fine amount of silicone oil was coated on the surface of heaterelements of the thermal head, and thermoplastic resin film was caused toadhere to the surface of the heater elements by way of the silicone oil.In order to make the silicone oil layer between the film and the heaterelements as thin as possible, the film was pressed against the elementswith a swab to be brought into closer contact with the elements. Thenthis system was set to an optical microscope. A high-speed video camerawas set to the barrel of the microscope by way of an image intensifier.As the high speed video camera, an Ectapro HS motion analyzer 4540(manufactured by Kodak) was used at a rate of 40,500 frames per second(frame rate ≈24.7 ps) As the image intensifier, a high-brightnesshigh-speed gate {circle around (2)} unit 06598-40 (available fromHAMAMATSU PHOTONICS Co.,) was used with the exposure time set to 10 μs.The thermal head drive system was set to supply only one pulse to theheater elements. The high-speed video camera was set to start taking apicture in synchronization with start of supply of the pulse to theheater elements. The optical microscope was set so that a bright-fieldimage was observed through the microscope, and the combination of theobjective and the barrel lenses were selected so that an overall imageof the perforation corresponding to one heater element of the thermalhead was taken as large as possible. Accordingly, for a thermal head ofa different resolution, a different combination of the objective and thebarrel lenses was employed.

When a pulse was applied to the heater element of the thermal head underthe conditions described above, the video camera started taking apicture in synchronization with start of supply of the pulse to theheater element. Thereafter, still images of the respective frames weretaken in by a personal computer by way of a video capture. By the use ofan image analysis software, the diameter of the perforation in the mainscanning direction, the diameter of the perforation in the sub-scanningdirection, the diameter of the perforation in the direction in which thediameter was maximized were obtained on the basis of a calibrated scale.As the image analysis software, an image analysis package MacSCOPE(Mitsuya Commercial Company) was used.

With reference to FIG. 5, “the diameter of the perforation” is definedas follows. That is, in a perforation 21, the diameter of theperforation 21 in a given direction is a length 25 of an orthographicprojection of the inner periphery (a boundary defined by a dark regionof the inner slope of the rim in a bright-field image obtained though anoptical microscope) of the rim 23 (an annular thickened part generatedby thermal perforation) of the perforation 21 onto a straight line 24parallel to the given direction.

The area of the perforation is obtained by the use of the aforesaidimage analysis software on the basis of the aforesaid scale from theimages taken in. The “area of the perforation” is the area of the partcircumscribed by the inner periphery of the rim and obtained by cuttingout the part by edge enhancement and binary-coding and determining thearea of the part by image analysis.

Embodiment 1

20 parts by weight of polyethylene terephthalate containing therein 2 wt% of silica 1.0 μm in mean particle size, 80 parts by weight of ethyleneterephthalate-ethylene isophthalate copolymer (copolymerized with 17.5mol % of isophthalic acid) and 0.1 parts by weight of cerotic acidmyristyl were fused, kneaded and extruded with a biaxial extruder andthen cut into raw material of copolymer polyester resin (copolymerizedwith 14 mol % of isophthalic acid; viscosity η=0.60 [Pa·s], Tm=225° C.).Then the raw material was dried under vacuum for 3 hours at 175° C. bythe use of a rotary dryer. The raw material was extruded by an extruder40 mm in screw diameter with the cap of the T-die held at 270° C., andwas cast on a cooling drum 300 mm in diameter, whereby un-oriented sheet13 μm thick was obtained. Then the un-oriented sheet was oriented to 3.5times in the longitudinal direction by a series of heated rolls at 90°C., and the longitudinally oriented sheet was further oriented to 3.5times in the transverse direction by a tenter transverse stretchingmachine at 95 C. Further, the sheet was subjected to heat treatment at120° C. for 10 seconds in the tenter, whereby biaxially oriented film1.0 μm thick was prepared.

The film by itself was perforated under the conditions shown in thefollowing table 1.

Further the same film was laminated with paper made of polyester fiber 4μm in mean fiber diameter (40 wt %) blended with Manila hemp fiber 15 μmin mean fiber diameter (60 wt %) by polyvinyl acetate resin coatedtherebetween in an amount of 0.5 g/m². The paper was 10 g/m² in weighingand 35 μm in thickness. Then silicone releasing agent was coated on thesurface of the film in an amount of 0.1 g/m², thereby obtaining aheat-sensitive stencil material.

Further, by the use of the stencil material thus obtained, a stencil wasmade under the conditions shown in the following table 1 and printingwas done by the use of the stencil.

Embodiment 2

100 parts by weight of polyethylene terephthalate copolymer containingtherein 25 mol % of ethylene terephthalate unit, containing therein 0.4wt % of silica 1.5 μm in mean particle size, and 0.1 parts by weight ofcerotic acid myristyl were fused, kneaded and extruded with a biaxialextruder and then cut into raw material of copolymer polyester resin(viscosity η=0.62 [Pa·s], Tm=197° C.). Then the raw material was driedunder vacuum for 5 hours at 15° C. by the use of a rotary dryer. The rawmaterial was extruded by an extruder 40 mm in screw diameter with thecap of the T-die held at 260° C., and was cast on a cooling drum 300 mmin diameter, whereby un-oriented sheet 21 μm thick was obtained. Thenthe un-oriented sheet was oriented to 3.5 times in the longitudinaldirection by a series of heated rolls at 85° C., and the longitudinallyoriented sheet was further oriented to 3.5 times in the transversedirection by a tenter transverse stretching machine at 9° C. Further,the sheet was subjected to heat treatment at 100° C. for 10 seconds inthe tenter, whereby biaxially oriented film 1.7 μm thick was prepared.

The film by itself was perforated under the conditions shown in thefollowing table 1. Further, by the use of the stencil material, astencil was made under the conditions shown in the following table 1 andprinting was done by the use of the stencil.

Embodiment 3

80 parts by weight of L-lactic acid and 20 parts by weight ofhydroxycaproic acid were introduced into a reactor and the mixture wasstirred at 145° C., 6000 Pa for 4 hours to distill water out of themixture. Then 0.05 parts by weight of tin was added and the resultantmixture was further stirred for 3 hours, whereby low polymer wasobtained. The lower polymer was subsequently added with 0.2 parts byweight of tin and 200 parts by weight of diphenyl ether and theresultant mixture was subjected to azeotropic dehydration at 148° C.,4400 Pa, and kept react for 30 hours while distilled water and solventwere separated by a water separator and only the solvent was returned tothe reactor, whereby L-lactic acid polymer solution was obtained. Thenthe solution was cooled to 40° C. and the deposit was filtered. Furtherthe deposit was washed with n-hexane and dried under vacuum. Obtainedpowder was added with 15 Kg of 0.5N hydrochloric acid and 15 Kg ofethanol and separated by filtration and dried after being stirred,whereby L-lactic acid polymer was obtained.

100 parts by weight of the L-lactic acid polymer thus obtained was mixedwith 0.5 parts by weight of calcium carbonate 0.5 μm in mean particlesize and the resultant mixture was extruded and pelletized by a reversebiaxial extruder at 200° C. The obtained pellet was treated at 50° C.under vacuum, and crystallized and dried. Then the pellet was melted andextruded at 200° C. by an extruder 40 mm in screw diameter, and was caston a cooling drum 300 mm in diameter, whereby un-oriented sheet 10 μmthick was obtained. Then the un-oriented sheet was oriented to 3.5 timesin the longitudinal direction by a series of heated rolls at 65° C., andthe longitudinally oriented sheet was further oriented to 3.5 times inthe transverse direction by a tenter transverse stretching machine at70° C. Further, the sheet was subjected to heat treatment at 80° C. for10 seconds in the tenter, whereby biaxially oriented film 0.8 μm thickwas prepared.

The film by itself was perforated under the conditions shown in thefollowing table 1.

Further the same film was laminated with paper made of polyester fiber 4μm in mean fiber diameter (40 wt %) blended with Manila hemp fiber 15 μmin mean fiber diameter (60 wt %) by polyvinyl acetate resin coatedtherebetween in an amount of 0.5 g/m². The paper was 10 g/m² in weighingand 35 μm in thickness. Then silicone releasing agent was coated on thesurface of the film in an amount of 0.1 g/m², thereby obtaining aheat-sensitive stencil material.

Further, by the use of the stencil material thus obtained, a stencil wasmade under the conditions shown in the following table 1 and printingwas done by the use of the stencil.

Embodiment 4

The same polyester resin as in the embodiment 3 was cast on a coolingdrum and un-oriented sheet 20 μm thick was obtained. Then theun-oriented sheet was oriented to 3.5 times in the longitudinaldirection by a series of heated rolls at 65° C., and the longitudinallyoriented sheet was further oriented to 3.5 times in the transversedirection by a tenter transverse stretching machine at 70° C. Further,the sheet was subjected to heat treatment at 100° C. for 10 seconds inthe tenter, whereby biaxially oriented film 1.6 μm thick was prepared.Further a heat-sensitive stencil material was obtained in the samemanner as in the embodiment 1.

The film by itself was perforated under the conditions shown in thefollowing table 1 and by the use of the stencil material thus obtained,a stencil was made under the conditions shown in the following table 1and printing was done by the use of the stencil.

Embodiment 5

The same film and heat-sensitive stencil material as those employed inthe embodiment 2 were used.

The film by itself was perforated under the conditions shown in thefollowing table 1. Further, by the use of the stencil material, astencil was made under the conditions shown in the following table 1 andprinting was done by the use of the stencil.

Embodiments 6 and 7

The same film and heat-sensitive stencil material as those employed inthe embodiment 3 were used.

The film by itself was perforated under the conditions shown in thefollowing table 1. Further, by the use of the stencil material, astencil was made under the conditions shown in the following table 1 andprinting was done by the use of the stencil.

Embodiments 8 and 9

The same polyester resin as in the embodiment 3 was cast on a coolingdrum and un-oriented sheet 20 μm thick was obtained. Then theun-oriented sheet was oriented to 3.5 times in the longitudinaldirection by a series of heated rolls at 65° C., and the longitudinallyoriented sheet was further oriented to 3.5 times in the transversedirection by a tenter transverse stretching machine at 70° C. Further,the sheet was subjected to heat treatment at 80° C. for 10 seconds inthe tenter, whereby biaxially oriented film 1.6 μm thick was prepared.Further a heat-sensitive stencil material was obtained in the samemanner as in the embodiment 1.

The film by itself was perforated under the conditions shown in thefollowing table 1 and by the use of the stencil material thus obtained,a stencil was made under the conditions shown in the following table 1and printing was done by the use of the stencil.

Embodiment 10

10 parts by weight of polyethylene terephthalate containing therein 2 wt% of silica 1.5 μm in mean particle size, 90 parts by weight of ethyleneterephthalate-ethylene isophthalate copolymer (copolymerized with 22.3mol % of isophthalic acid) and 0.1 parts by weight of cerotic acidmyristyl were fused, kneaded and extruded with a biaxial extruder andthen cut into raw material of copolymer polyester resin (copolymerizedwith 20 mol % of isophthalic acid; viscosity η=0.60[Pa·s], Tm=220° C.).Then the raw material was dried under vacuum for 3 hours at 175° C. bythe use of a rotary dryer. The raw material was extruded by an extruder40 mm in screw diameter with the cap of the T-die held at 270° C., andwas cast on a cooling drum 300 mm in diameter, whereby un-oriented sheet18 μm thick was obtained. Then the un-oriented sheet was oriented to 3.2times in the longitudinal direction by a series of heated rolls at 85°C., and the longitudinally oriented sheet was further oriented to 3.2times in the transverse direction by a tenter transverse stretchingmachine at 90° C. Further, the sheet was subjected to heat treatment at100° C. for 10 seconds in the tenter, whereby biaxially oriented film1.7 μm thick was prepared.

Further, heat-sensitive stencil material was obtained in the same manneras in embodiment 1. The film by itself was perforated under theconditions shown in the following table 1. Further, by the use of thestencil material thus obtained, a stencil was made under the conditionsshown in the following table 1 and printing was done by the use of thestencil.

Embodiment 11

The same film and heat-sensitive stencil material as those employed inthe embodiment 8 were used.

The film by itself was perforated under the conditions shown in thefollowing table 1. Further, by the use of the stencil material, astencil was made under the conditions shown in the following table 1 andprinting was done by the use of the stencil.

Embodiment 12

The same film and heat-sensitive stencil material as those employed inthe embodiment 4 were used.

The film by itself was perforated under the conditions shown in thefollowing table 1. Further, by the use of the stencil material, astencil was made under the conditions shown in the following table 1 andprinting was done by the use of the stencil.

Comparative Example 1

The same polyester resin as in the embodiment 1 was cast on a coolingdrum and un-oriented sheet 21 μm thick was obtained. Then theun-oriented sheet was oriented to 3.2 times in the longitudinaldirection by a series of heated rolls at 90° C., and the longitudinallyoriented sheet was further oriented to 3.2 times in the transversedirection by a tenter transverse stretching machine at 95° C. Further,the sheet was subjected to heat treatment at 140° C. f or 10 seconds inthe tenter, whereby biaxially oriented film 2.0 μm thick was prepared.Further a heat—sensitive stencil material was obtained in the samemanner as in the embodiment 1.

The film by itself was perforated under the conditions shown in thefollowing table 1 and by the use of the stencil material thus obtained,a stencil was made under the conditions shown in the following table 1and printing was done by the use of the stencil.

Comparative Example 2

50 parts by weight of the same polyester resin material as in theembodiment 1 was mixed with 50 parts by weight of butylene terephthalatecontaining dimethyl terephthalate and 1,4-butanediol as major components(100 mol %). The resultant mixture was extruded at 250° C., and was caston a cooling drum 300 mm in diameter, whereby un-oriented sheet 24 μmthick was obtained. Then the un-oriented sheet was oriented to 4.3 timesin the longitudinal direction by a series of heated rolls at 65° C., andthe longitudinally oriented sheet was further oriented to 4.3 times inthe transverse direction by a tenter transverse stretching machine at70° C. Further, the sheet was subjected to heat treatment at 90° C. for6 seconds in the tenter, whereby biaxially oriented film 1.5 μm thickwas prepared.

Further, heat-sensitive stencil material was obtained in the same manneras in embodiment 1. The film by itself was perforated under theconditions shown in the following table 1. Further, by the use of thestencil material thus obtained, a stencil was made under the conditionsshown in the following table 1 and printing was done by the use of thestencil.

The result of measurement of the shapes of the perforations formed inthe thermoplastic resin film by itself in the embodiments 1 to 12 andthe comparative examples 1 and 2 is shown in the following tables 2 and3.

In the following table 2, the diameters dx₁ and dy₁ in the main scanningdirection and the sub-scanning direction, the maximum diameter L₁ andthe area a₁ of the perforation at the time point t₁ at which supply ofenergy to the heater element was cut, the diameters dx₂ and dy₂ in themain scanning direction and the sub-scanning direction, and the area a₂of the perforation at the time t₂ at which enlargement of theperforation was stopped (in the final state) are shown. Further, at thetime points t₁ and t₂, the shape of the perforation was measured underthe same conditions.

The time t₁ at which supply of energy to the heater element was cut wasthe time at which the voltage waveform or the energy waveform which wasapplied to the heater element for perforating one pixel was ended, andthe energizing time is the time interval from the time at which supplyof power to the heater element was started to the time at which it iscut. When the waveform is intermittent, the energizing time includes thequiescent time.

In the following table 3, the quotients obtained by dividing the maximumdiameters at the time t₁ by the time interval t₁, the ratios of thediameters dx₂ and dy₂ in the main scanning direction and thesub-scanning direction at the time point t₂ to the scanning pitchesp_(x) and p_(y) in the respective directions, and the ratio of the areaa₂ of the perforation at the time point t₂ to the product p_(x)·p_(y) ofthe scanning pitches in the main scanning direction and in thesub-scanning direction are shown.

The shapes of the perforations formed in the heat-sensitive stencilmaterial in the embodiments 1 to 12 and the comparative examples 1 and 2were evaluated in the following manner and the result is shown in thefollowing table 4.

Using the heat-sensitive stencil materials obtained in the embodiments 1to 12 and the comparative examples 1 and 2, stencil were made bydifferent thermal heads (which were equal to or different from thethermal head employed in a stencil printer RISOGRAPH GR377 (RISO KAGAKUCORPORATION) in resolution) under the conditions shown in the table 1.Each stencil included a black solid portion of 10 mm×10 mm (▪) and thincharacters formed by one or two dots.

The perforations in the black solid portion of the stencils thusobtained were observed through an optical microscope and (1) perforatingperformance and (2) sensitivity to perforation of the heat-sensitivestencil materials were evaluated on the basis of the followingstandards.

(1) Perforating performance of the heat-sensitive stencil materials

⊚: Perforations were of the target size and were uniform in size.

∘: Though perforations were substantially of the target size, theperforations somewhat fluctuated in size.

: Though the size of the perforations were partly insufficient, thestencil was practically acceptable.

×: A substantial part of the perforations were unsatisfactory in sizeand the stencil was practically unacceptable.

(2) sensitivity to perforation of the heat-sensitive stencil materials

⊚: Perforations of the target size were obtained with very small energy.

∘: Perforations of the target size were obtained with relatively smallenergy.

: Relatively large energy was required to obtain perforations of thetarget size but practically acceptable.

×: Large energy was required to obtain perforations of the target sizeand perforations of the target size sometimes could not be obtained.

Using the stencils obtained in the embodiments 1 to 12 and thecomparative examples 1 and 2, printing was done and the printingsobtained were evaluated.

The stencils were manually mounted on the printing drum of a stencilprinter RISOGRAPH GR377 (RISO KAGAKU CORPORATION), and printing was doneat the room temperature using RISOGRAPH INK GR-HD under the standardconditions of RISOGRAPH GR377 (power source ON). The printings obtainedwere evaluated on (3) quality of the solid portion, (4) blur in the thincharacters, (5) saturation in the thin characters and (6) offset on thebasis of the following standards. The result is shown in the followingtable 4.

(3) Quality of the solid portions.

The degree of fluctuation in density by parts (microscopic parts notlarger than about 1 mm in cycle) due to fluctuation in mean density andshape of the perforations were subjectively evaluated on the basis ofthe following standards.

⊚: Density was sufficient and no fluctuation in density was felt.

∘: Slight fluctuation in density was felt but density was practicallyacceptable. Both reproducibility of solid portions in text originals andreproducibility of tones of picture originals were acceptable.

Δ: Though reproducibility of solid portions in text originals wasacceptable, reproducibility of tones of shadow portions of pictureoriginals was insufficient.

×: Fluctuation in density was remarkable. Both reproducibility of solidportions in text originals and reproducibility of tones of pictureoriginals were unacceptable.

(4) Blur in the thin characters.

The degree of blur (interruption of a pattern which was to becontinuous) in the thin characters due to fluctuation in shape of theperforations were subjectively evaluated on the basis of the followingstandards.

⊚: No blur was felt.

∘: Though slight blur was felt, reproducibility of thin characters(black characters on a white ground) in text originals andreproducibility of tones of highlight portions of picture originals wereboth acceptable.

Δ: Though reproducibility of thin characters (black characters on awhite ground) in text originals was acceptable, reproducibility of tonesof highlight portions of picture originals was poor.

×: Blur was remarkable and reproducibility of thin characters (blackcharacters on a white ground) in text originals and reproducibility oftones of highlight portions of picture originals were both unacceptable.

(5) Saturation in the thin characters.

The degree of saturation in the thin characters (loss of the whiteground between adjacent two patterns) due to fluctuation in shape of theperforations were subjectively evaluated on the basis of the followingstandards.

⊚: No saturation was felt.

∘: Though slight saturation was felt, reproducibility of thin characters(black characters on a white ground) in text originals andreproducibility of tones of shadow portions of picture originals wereboth acceptable.

Δ: Though reproducibility of thin characters (black characters on awhite ground) in text originals was acceptable, reproducibility of tonesof shadow portions of picture originals was poor.

×: Saturation was remarkable and reproducibility of thin characters(black characters on a white ground) in text originals andreproducibility of tones of shadow portions of picture originals wereboth unacceptable.

(6) Offset

The degree of offset (the back side of a printed sheet is stained by inkon the surface of the preceding printed sheet) was subjectivelyevaluated on the basis of the following standards.

⊚: No offset was felt.

∘: Though slight offset was felt, the offset was at a such a level as toinvolve no problem even in originals where the solid portion was largeand a large amount of ink was transferred to the printings. Theprintings were acceptable for a formal use.

Δ: Offset was at a level such that no problem was involved in parts suchas thin characters (black characters on a white ground) or highlightportions where the amount of ink transferred to the printings was smallbut stain was remarkable in the part such as a large solid portion wherethe amount of ink transferred to the printings was large. The printingswere unacceptable for a formal use though acceptable for an informaluse.

×: Offset was remarkable almost over the entire area of the original.The printings were unacceptable for both a formal use and an informaluse.

As shown in the table 3, the quotients (L₁/t₁) obtained by dividing themaximum diameters at the time t₁ by the time interval t₁ were in therange of 0.015 m/s to 0.23 m/s in the embodiments 1 to 12. As can beunderstood from the table 4, the evaluation of the perforatingperformance and sensitivity to perforation of the stencil materials ofthe embodiments 1 to 12 were all satisfactory. Further, evaluation ofthe printings printed by the use of the stencils made of the stencilmaterials of embodiments 1 to 12 on quality of the solid portion, blurin the thin characters, saturation in the thin characters and offsetwere all satisfactory.

Further, sensitivity to perforation was excellent in embodiments 1, 3,4, 7 and 9. This proves that better sensitivity to perforation can beobtained when L₁/t₁ is in the range of 0.080 m/s to 0.23 s/m (morepreferably 0.090 m/s to 0.23 s/m).

In embodiments 5 and 8, where L₁/t₁ was in the range of 0.06 m/s to0.075 m/s, the evaluation on perforating performance and sensitivity toperforation were not the best, but embodiments 5 and 8 were higher inthe worst evaluation as compared with the other embodiments. This provesthat when L₁/t₁ is in the range of 0.060 m/s to 0.075 s/m, performancecan be generally improved.

In embodiments 10, 11 and 12, the evaluation of the perforatingperformance were excellent, and it could be understood that theseembodiments were preferable to obtain high image quality. This provesthat when L₁/t₁ is in the range of 0.015 m/s to 0.055 s/m, morepreferably 0.015 m/s to 0.045 s/m, the perforating performance can beimproved. This is applicable to a high resolution system higher than 600dpi.

To the contrast, as shown in the table 3, the quotients (L₁/t₁) obtainedby dividing the maximum diameters at the time t₁ by the time interval t₁were 0.014 m/s and 0.241 m/s, respectively, in the comparative examples1 and 2. As can be understood from the table 4, the evaluation of theperforating performance and sensitivity to perforation of the stencilmaterials of the comparative examples 1 and 2 were not bothsatisfactory.

On the basis of the fact that the state of perforation as measured inthe thermoplastic film by itself has a high correlation with that asmeasured in the thermoplastic film laminated on the porous support sheetas described above, the result of the above experiment proves thatdiscreteness of the perforations can be ensured, the shape of theperforations can be stabilized and sensitivity to perforation can beexcellent, when the heat shrinkable properties of the thermoplasticresin film for the stencil material are such that the mean enlargingspeed over the energizing time of the diameter of perforation in thedirection in which the diameter of the perforation is the largest in allthe directions at the time at which supply of energy to the heat sourceis cut is not smaller than 0.015 m/s and not larger than 0.23 m/s (morepreferably not smaller than 0.06 m/s and not larger than 0.075 m/s).

When the heat shrinkable properties of the thermoplastic resin film forthe stencil material are such that the mean enlarging speed is notsmaller than 0.015 m/s and not larger than 0.055 m/s (more preferablynot smaller than 0.015 m/s and not larger than 0.045 m/s), high imagequality can be obtained.

Further, when the heat shrinkable properties of the thermoplastic resinfilm for the stencil material are such that the mean enlarging speed isnot smaller than 0.08 m/s and not larger than 0.23 m/s (more preferablynot smaller than 0.09 m/s and not larger than 0.23 m/s), sensitivity toperforation and perforating speed are improved.

Further, when the diameters of the perforation in the main scanningdirection and the sub-scanning direction in the final state are set notsmaller than 45% and not larger than 80% of the scanning pitches in therespective directions, or when the area of the perforation in the finalstate is set to be not smaller than 20% and not larger than 50% of theproduct of the scanning pitches in the main scanning and sub-scanningdirections, the amount of ink transferred through the stencil obtainedcan be such that offset can be avoided in solid parts while necessarydensity is ensured, and thin character parts can be sufficient in widthand density.

Though, in the embodiments 1 to 12 described above, the stencilmaterials comprises a porous support sheet and a thermoplastic filmresin laminated with the support sheen, the stencil materials maycomprise only the thermoplastic film resin.

TABLE 1 emb.1 emb.2 emb.3 emb.4 emb.5 emb.6 emb.7 film polymer A C D D CD D heat treatment ° C. 120 100 80 100 100 80 80 thickness μm 1.0 1.70.8 1.6 1.7 0.8 0.8 thermal resolution (main) Dpi 400 400 400 400 600600 600 head resolution (sub) Dpi 400 400 400 400 600 600 600 scanningpitch (main)p_(x) μm 63.5 63.5 63.5 63.5 42.3 42.3 42.3 scanning pitch(sub)p_(y) μm 63.5 63.5 63.5 63.5 42.3 42.3 42.3 element size (main) μm30 30 30 30 20 20 20 element size (sub) μm 40 40 40 40 25 25 25 meanpower mW 120 85.2 139 139 107.2 41.0 44.0 energizing time μs 350 560 150200 340 240 170 energy supplied μj 42.0 47.7 20.8 27.8 36.4 9.8 7.5emb.8 emb.9 emb.10 emb.11 emb.12 co. co. ex. ex. 1 2 film polymer D D BD D A E heat treatment ° C. 80 80 100 80 100 140 80 thickness μm 1.6 1.61.7 1.6 1.6 2.0 1.5 thermal resolution (main) Dpi 600 600 800 800 800600 400 head resolution (sub) Dpi 600 600 800 800 800 600 400 scanningpitch (main) μm 42.3 42.3 31.8 31.8 31.8 42.3 63.5 scanning pitch (sub)μm 42.3 42.3 31.8 31.8 31.8 42.3 63.5 element size (main) μm 20 20 15 1515 20 20 element size (sub) μm 25 25 19 19 19 25 25 mean power mW 54.065.0 35.0 44.0 49.0 60.8 150 energizing time μs 340 240 700 500 350 680170 energy supplied μj 18.2 15.6 24.7 22.1 17.3 41.3 25.5 A: ethyleneterephthalate-ethylene isophthalate copolymer (copolymerized with 14 mol% of isophthalic acid) B: ethylene terephthalate-ethylene isophthalatecopolymer (copolymerized with 20 mol % of isophthalic acid) C: ethyleneterephthalate-ethylene isophthalate copolymer (copolymerized with 25 mol% of isophthalic acid) D: L-lactic acid polymer E: 50:50 blend ofpolymer A and polyethylene terephthalate

TABLE 2 emb. emb. emb. emb. emb. emb. emb. 1 2 3 4 5 6 7 t₁ μs 350 560150 200 340 240 170 dx₁ μm 29.1 29.7 29.5 31.0 24.0 20.0 22.5 dy₁ μm25.2 29.7 30.5 34.0 19.2 18.5 21.5 L₁ μm 29.3 31.8 31.8 36.0 22.1 19.021.5 a₁ μm² 614.2 739.2 753.5 882.7 387.2 309.9 405.1 dx₂ μm 34.0 36.333.0 40.0 28.8 23.0 26.0 dy₂ μm 30.1 34.7 35.0 37.5 27.2 20.0 23.0 a₂μm² 856.2 1054.1 967.3 1256.3 658.2 385.3 500.8 emb. emb. emb. emb. emb.co. ex. co. ex. 8 9 10 11 12 1 2 t₁ μs 340 240 700 500 350 680 170 dx₁μm 25.0 24.0 13.0 20.0 17.0 9.0 40.0 dy₁ μm 22.0 23.0 11.5 17.5 15.0 9.038.5 L₁ μm 24.5 23.5 13.5 20.5 17.5 9.5 41.0 a₁ μm² 460.6 462.3 125.2293.1 213.6 67.8 1289.8 dx₂ μm 28.0 28.0 16.4 23.0 21.0 15.5 42.2 dy₂ μm25.0 24.5 14.8 19.0 16.5 14.5 39.6 a₂ μm² 586.3 574.5 203.3 366.0 290.2188.2 1399.6

TABLE 3 emb.1 emb.2 emb.3 emb.4 emb.5 emb.6 emb.7 L₁/t₁ m/s 0.084 0.0570.212 0.180 0.065 0.079 0.127 dx₂/p_(x) % 53.5 57.2 52.0 63.0 68.1 54.461.5 dy₂/p_(y) % 47.4 54.6 55.1 59.7 64.3 47.3 54.4 a₂/p_(x) · p_(y) %21.2 26.1 24.0 31.2 36.8 21.5 28.0 emb.8 emb.9 emb.10 emb.11 emb.12 co.ex. 1 co. ex. 2 L₁/t₁ m/s 0.072 0.098 0.019 0.041 0.050 0.014 0.241dx₂/p_(x) % 66.2 66.2 51.6 72.3 66.0 36.6 66.5 dy₂/p_(y) % 59.1 57.946.5 59.7 51.9 34.3 62.4 a₂/p_(x) · p_(y) % 32.8 32.1 20.1 36.2 28.710.5 34.7

TABLE 4 emb. 1 emb. 2 emb. 3 emb. 4 emb. 5 emb. 6 emb. 7 shape;performance  ∘   ∘   sensitivity ⊚  ⊚ ⊚ ∘ ∘ ⊚ printings; solidquality ∘ ∘ ∘ ⊚ ⊚ ∘ ⊚ blur ∘ ∘ ∘ ⊚ ⊚ ∘ ⊚ saturation ⊚ ∘ ⊚ ∘ ∘ ⊚ ∘ offset∘ ∘ ⊚ ∘ ∘ ⊚ ∘ emb. 8 emb. 9 emb. 10 emb. 11 emb. 12 co.ex. 1 co.ex. 2shape; performance ∘  ⊚ ⊚ ∘ Δ x sensitivity ∘ ⊚    x ⊚ printings;solid quality ⊚ ⊚ ∘ ⊚ ⊚ x Δ blur ⊚ ⊚ ∘ ⊚ ⊚ x ⊚ saturation ∘ ∘ ⊚ ∘ ∘ ⊚ xoffset ∘ ∘ ⊚ ∘ ∘ ∘ x

What is claimed is:
 1. A method of making a stencil by thermally formingperforations arranged in both a main scanning direction and asub-scanning direction in a thermoplastic resin film of heat-sensitivestencil material by the use of a heat source which is heated through asupply of energy, the heat source having a scanning pitch in each of thescanning directions, the method comprising the steps of: cutting thesupply of energy to the heat source so that a quotient obtained bydividing a maximum diameter of a perforation at the time at which thesupply of energy to the heat source is cut by the energizing time is notsmaller than 0.015 m/s and not larger than 0.18 m/s.
 2. A method asdefined in claim 1, in which the supply of energy to the heat source iscut so that the quotient obtained by dividing the maximum diameter ofthe perforation at the time at which supply of energy to the heat sourceis cut by the energizing time is not smaller than 0.08 m/s and notlarger than 0.18 m/s.
 3. A method as defined in claim 1, in which thesupply of energy to the heat source is cut so that the diameters of theperforation in the main scanning direction and the sub-scanningdirection in the final state are not smaller than 45% and not largerthan 80% of the scanning pitches in the respective directions.
 4. Amethod as defined in claim 1, in which the supply of energy to the heatsource is cut so that the area of the perforation in the final state isnot smaller than 20% and not larger than 50% of the product of thescanning pitches in the main scanning direction and in the sub-scanningdirection.
 5. A method of making a stencil by thermally formingperforations arranged in both a main scanning direction and asub-scanning direction in a thermoplastic resin film of heat-sensitivestencil material by the use of a heat source which is heated through asupply of energy, the heat source having a scanning pitch in each of thescanning directions, the method comprising the steps of: cutting thesupply of energy to the heat source so that a quotient obtained bydividing a maximum diameter of a perforation at the time at which thesupply of energy to the heat source is cut by the energizing time is notsmaller than 0.06 m/s and not larger than 0.075 m/s.
 6. A method ofmaking a stencil by thermally forming perforations arranged in both amain scanning direction and a sub-scanning direction in a thermoplasticresin film of heat-sensitive stencil material by the use of a heatsource which is heated through a supply of energy, the heat sourcehaving a scanning pitch in each of the scanning directions, the methodcomprising the steps of: cutting the supply of energy to the heat sourceso that a quotient obtained by dividing a maximum diameter of aperforation at the time at which the supply of energy to the heat sourceis cut by the energizing time is not smaller than 0.015 m/s and notlarger than 0.055 m/s.